Telechips CEO Jang-Kyu Lee, said, “By combining our advanced semiconductor solutions with their expertise in vehicle software and hardware integration, we are paving the way for safer, smarter, and more connected mobility solutions, enabling OEMs to lead in the SDV era.”
The collaboration will focus on co-developing a scalable software framework for ADAS and autonomous vehicle platforms, leveraging Artificial Intelligence to enhance situational awareness and decision-making capabilities, the statement said.
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The partnership addresses critical industry needs such as real-time updates, seamless connectivity, and enhanced safety, it added.








