SK hynix to build first U.S. packaging plant for HBM — plugs critical hole in U.S. supply chain, $3.9B investment challenges TSMC and reshapes AI supply chains

SK hynix is bringing its HBM ambitions to U.S. soil with a $3.9 billion plan to build its first domestic manufacturing facility — a 2.5D advanced packaging plant in West Lafayette, Indiana. The site, developed in partnership with Purdue University, is aimed at producing turnkey HBM modules for AI accelerators by 2028.

In bringing manufacturing to the U.S., SK hynix aims to vertically integrate its HBM supply chain, which currently relies on outside firms, to handle the delicate process of mounting…