Researchers achieve breakthrough integration of 2D materials on standard silicon chips

For the first time, scientists have successfully built a fully functional memory chip using two-dimensional materials and integrated it directly onto a conventional silicon die — a milestone that could change how future semiconductors are made. The research, led by Chunsen Liu and colleagues at Fudan University in Shanghai, was published on October 9 in the journal Nature.

The research may mark a turning point for 2D electronics, which have long promised atomic-scale performance and efficiency but…