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MediaTek CEO Rick Tsai announces successful development of first 3nm chipset, rumored to be called Dimensity 9400. MediaTek and TSMC working together to optimize efficiency for Dimensity 9400, which lacks low-power cores. AI boom expected to bring positive outcome. Dimensity 9300 currently most powerful smartphone chipset, increasing MediaTek’s market share. Partnership with TSMC allows focus on 3nm chipset, also partnering with Intel for 16nm node. Dimensity 9400 to use TSMC’s N3E process, offering improved yields. Cortex-X5 paired with unnamed CPU design in Dimensity 9400 for improved multi-core performance. MediaTek and Qualcomm expected to introduce more improved silicon in 2024.
