One of the key elements of Apple’s A-series and M-series chips is the System-on-a-Chip (SoC) design which tightly integrates all the components within a single package. This includes both CPU and GPU.
But a new report suggests that the M5 Pro chip may take a different approach of having more separated CPU and GPU in order to improve performance and boost production yields …
System-on-a-chip approach
Traditional computers and computer-like devices had completely separate CPU (central processing unit) and GPU (graphical processing unit), often on completely separate circuit boards.
With the iPhone, Apple integrated the two in an approach known as a System-on-a-Chip (SoC). Essentially what would have been completely separate chips are integrated into a single, tightly-integrated unit containing circuitry for both. It has replicated that approach in other devices, including M-series chips for Apple Silicon Macs.
Whether we consider this a single chip or a compact package of different chips is to large degree a matter of semantics, but Apple refers to singular chips – as in the A18 Pro chip, and the M4 chip.
M5 Pro chip with separate CPU and GPU
Apple analyst Ming-Chi Kuo says that for the M5 Pro chip, Apple will be taking advantage of TSMC’s very latest chip packaging process known as SoIC-mH (System-on-Integrated-Chips-Molding-Horizontal).
SoIC-mH refers to a method of integrating different chips into a package in a way which improves thermal performance, and therefore allows a chip to run at full power for longer before it needs to be throttled back to reduce heat. It also reportedly boosts production yields, with fewer chips failing to pass quality control.
Kuo’s report says this approach will be used for the M5 Pro, Max, and Ultra variants of the upcoming M5 chip.
The M5 series chips will adopt TSMC’s advanced N3P node, which entered the prototype phase a few months ago. M5, M5 Pro/Max, and M5 Ultra mass production is expected in 1H25, 2H25, and 2026, respectively.
The M5 Pro, Max, and Ultra will utilize server-grade SoIC packaging. Apple will use 2.5D packaging called SoIC-mH (molding horizontal) to improve production yields and thermal performance, featuring separate CPU and GPU designs.
Interestingly, it was earlier reported that the iPhone 18 will also start separating out different elements of the A-series chip, though that report pointed to RAM – which is also currently integrated into the chip.
Will also be used to power Apple Intelligence servers
Kuo also indicated that M5 Pro chips would be used in Apple Intelligence servers, known as Private Cloud Compute (PCC).
Apple’s PCC infrastructure build-out will accelerate after the mass production of the high-end M5 chips, better suited for AI inferencing.
Image: Michael Bower/9to5Mac
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