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Friday, December 19, 2025

What Are You Looking For?

AgriTech AI AirTech All News Apple Artificial Intelligence AviationTech B2B BeautyTech Blockchain

Recent

35+ Mac apps – build your own bundle from $2.50
Issue Subscribed 5% On Day 1 So Far
Lehar Footwears announced H1FY26 and Q2FY26 results, Reports Strong Revenue and PAT Growth
Grab to invest $60m in Vay’s remote-driven EV service
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What Are You Looking For?

AgriTech AI AirTech All News Apple Artificial Intelligence AviationTech B2B BeautyTech Blockchain

Recent

35+ Mac apps – build your own bundle from $2.50
Issue Subscribed 5% On Day 1 So Far
Lehar Footwears announced H1FY26 and Q2FY26 results, Reports Strong Revenue and PAT Growth
Grab to invest $60m in Vay’s remote-driven EV service
Hardware

Huawei reveals long-range Ascend chip roadmap — three-year plan includes ambitious provision for in-house HBM with up to 1.6 TB/s bandwidth



Huawei’s AI silicon roadmap is no longer a state secret. Speaking at the Huawei Connect conference on September 18, rotating chairman Xu Zhijun outlined the company’s first official long-range Ascend chip strategy, with four new parts scheduled across the next three years: Ascend 950PR and 950DT in early 2026, followed by Ascend 960 and 970 in 2027 and 2028, respectively.

Huawei says its upcoming 950PR chip will ship in Q1 next year with in-house HBM designed to compete with the likes of SK hynix…



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